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Testing of Interposer-Based 2.5D Integrated Circuits

164,98 
164,98 
2025-07-31 164.9800 InStock
Nemokamas pristatymas į paštomatus per 18-22 darbo dienų užsakymams nuo 19,00 

Knygos aprašymas

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

Informacija

Autorius: Krishnendu Chakrabarty, Ran Wang,
Leidėjas: Springer Nature Switzerland
Išleidimo metai: 2017
Knygos puslapių skaičius: 196
ISBN-10: 3319547135
ISBN-13: 9783319547138
Formatas: Knyga kietu viršeliu
Kalba: Anglų
Žanras: Electronics: circuits and components

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